Copper Brightener - PP Stabiliser

Copper anode sheet - Copper plate electrode from Betzmann Galvanik Plate anode made of pure copper for bath electroplating   Sacrificial anode for copper electroplating Copper anode plate for acidic copper electrolytes, copper Cu min. 99.9 % (Cu-DHP, CW024A, 2.0090, SF-Cu) Electroplated copper is used to improve conductivity due to its very good electrical properties, also as an intermediate layer before nickel-plating and chrome-plating of steel surfaces to improve corrosion resistance, for pre-copper-plating zinc die-casting   Sheet thickness 0.7 mm available in sizes S (25 x 150 mm), M (50 x 80 mm), L (100 x 150 mm) and XL (170 x 200 mm) Individual cuts and sheet thicknesses of 1.0 and 2.0 mm also available on request (min. 1 m²)   Material: copper Size: L - 100 x 150 mm, M - 50 x 80 mm, S - 25 x 150 mm, XL - 170 x 200 mm Degree of purity: 99.9

Product information PP Copper Electrolyte from Betzmann Galvanik   Bright shiny copper electroplating - optimal directly on silver conductive lacquer or copper conductive lacquer With our Betzmann Galvanik "PP Copper Bright" you get a strong bright copper coating on metallic or conductive surfaces.   PP Copper Electrolyte - The clear advantages of electroplated copper plating A copper coating effectively protects workpieces made of iron and steel against rust and gives a visually appealing surface due to the typical red luster of the precious metal. Because of its good solderability, electroplated copper plating is ideal for the production of printed circuit boards and circuit boards. Simply use the copper electrolyte together with a graphite or copper anode and you can quickly provide a component with a shiny copper coating yourself. This copper plating solution is great for plating non-conductive materials. It brightly plates and smooths the surface. PP Copper also plates very well on brass and tin. When plating very large areas or building glossy surfaces on matte surfaces, we recommend mixing with PP stabilizer powder to prevent tarnishing.   Properties and Applications: Finishes glossy  Reduces the amount of polishing required for high gloss - saves time and money when finishing precious metals such as silver and gold Leveling Solution If the item to be plated is heavily scratched, you can coat PP Copper extra thick and then polish so you don't have to over polish the item first. Can be used to coat non-conductive surfaces such as wood. PP Copper is recommended for the first coat on conductive copper or silver conductive paint. Can be used for coating metals such as brass and tin. Applies very well to brass and tin. It also serves as a good primer for nickel and gold when plating tin.    Please note that PP stabilizer powder is not required when plating PP Copper with pin and pad plating on metals such as brass and tin. Pen Electroplating: 3 - 6 volt with graphite or copper electrode process.     Features Applications Plates bright Reduces the amount of polishing necessary to produce a high shine – saves you time and money when you want to go on to plate precious metals such as silver and gold Levelling solution If the item you’re plating is heavily scratched you can plate PP Copper extra thick and then polish back, saving you having to polish the item in the first place Can be used to plate non-conductive surfaces. PP Copper is recommended for the first plated layer onto Conductive Ink (hi-grade). When plating onto plastic an other non-conductors, we recommend the addition of PP Stabiliser. Can be used to plate onto metals like brass and pewter. Plates very well onto brass and pewter. It also serves as a good undercoat for nickel and gold when plating onto pewter.Please note that PP Stabiliser Powder is not necessary when plating PP Copper Brush Plating Solution on metals such as brass and pewter. Operating Conditions and Deposit Data Voltage Range 4.0 – 6.0 volts Temperature 14 – 25 °C Copper Concentration >60g/l Electrode Carbon Gold content in plate 100% (balance carbon) Plating Rate at (3.5 volts, Platinum electrode) Approx. 2 microns per minute (spot) Hardness 380 – 385 Hv Density of deposit 8.8 g/cm3 Stress Low stress Notes: We strongly advise against the use of stainless steel anodes for most of our plating processes especially in the case of PP Copper Brush Plating Solution Plating rates are calculated over a sample area which is permanently covered by swab. When plating onto brass or pewter, PP Stabiliser will not be required.