Professional Galvanik Complete System
€4,550.00
Available, delivery time: 1-2 weeks
Product information "Professional Galvanik Complete System "
Professional Electroplating Complete System BMG-50A-500
Short Description
The Professional Electroplating Complete System BMG-50A-500 is a high-performance mobile plating unit designed for reliable, reproducible electroplating of a wide range of metals including gold, silver, platinum, palladium, chrome, rhodium, nickel, copper, zinc, tin and bronze. Featuring High-Frequency Pulse (HFP) technology, this all-in-one workstation is ideal for workshop, lab, training or on-the-go plating services.
Product Description
This complete system integrates a 50 amp power unit with advanced HFP electronics that deliver dense, uniform metal deposition faster and with superior adhesion compared to conventional current sources. The HFP concept is widely recognized in high-end portable plating equipment to improve plating speed and finish quality.
It features adjustable DC output (3–12 V) and is designed to operate continuously (24 h) under industrial-like conditions, housed in a robust mobile workstation.
Scope of Supply
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Power Unit: 50 A output with High-Frequency-Pulse (HFP) technology, adjustable 3–12 V DC
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Cables & Holders: 5 extendable spiral cables, 4 handle mounts, organizer rail
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Workstation: Stainless steel trolley unit with seat, perforated tray and sump tray
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Anodes: 5 electrode rods (4× 6 mm stainless steel, 1× 4 mm stainless steel)
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Pads & Containers: 10 mixed sleeves, 4 consumable cups
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Electrolytes:
1 Liter Electrocleaner
1 Liter Chrome remover
1 Liter Activator
1 Liter Nickel Electrolyte
1 Liter alkaline copper electrolyte
500 ml Gold Electrolyte (8 g/L)
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Documentation & Support: German/English manuals and training videos, personal support
Key Technical Features
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High-Frequency Pulse (HFP): Produces finer, denser and more even metal layers, reducing porosity and improving coating quality – a technique also used in premium plating systems.
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Adjustable Voltage: Flexible 3–12 V DC for control and precision
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Durable Construction: Mobile stainless steel unit
Typical Applications
This system can electroplate virtually any conductive surface, including:
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Precious metals (gold, silver, platinum, palladium)
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Decorative finishes (chrome, rhodium, black rhodium/ruthenium)
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Functional metals (nickel, copper, zinc, tin, bronze)
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Industrial parts, jewelry, decorative pieces, technical components
Core Benefits
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Complete system: Includes power, electrodes, chemicals and pads
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Advanced HFP technology: Faster, smoother plating
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Mobile & flexible: Integrated workstation with storage and seat
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Broad metal compatibility: Suitable for decorative and functional plating
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Support & training: Manuals, videos and free personal technical help
Safety Notes
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Only suitable for conductive surfaces. Follow proper cleaning, activation and safety protocols.
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Use appropriate personal protective equipment and work in a ventilated area.
Conclusion
The Professional Electroplating Complete System BMG-50A-500 is a versatile, ready-to-use plating station for a wide range of metals and applications, blending high-end pulsed plating technology with a complete set-up suited to hobbyists, professionals and industrial users alike.
High-Frequency Pulse Plating (HFPP) – What It Is
High-Frequency Pulse Plating is a modern electrical deposition method used in brush/tampon plating in which the electrical current is not delivered as a continuous DC output, but rather as rapidly pulsed high-frequency impulses.
Typical pulse ranges:
• frequency: approx. 15–40 kHz
• pulse duration: microseconds to milliseconds
• waveform: usually rectangular/square pulses
• current delivery: modulated duty cycle for controlled metal ion transfer
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How It Works – Core Mechanism
Instead of a constant ion flow (continuous DC), the bath/gel or wet pad receives a sequence of micro-bursts of energy. Between pulses, short relaxation phases allow:
• ion diffusion back to the surface
• local replenishment of metal ions
• reduction of hydrogen buildup
• significantly reduced polarization effects
• lower thermal load on the substrate
The result is faster, cleaner, and denser deposition with lower defect rates.
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Technical Benefits for Brush / Tampon Galvanic Plating
Compared to conventional DC:
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Higher deposition quality
– smoother grain structure
– higher micro-hardness
– tighter nano-crystalline layer growth
– improved adhesion on difficult substrates -
Reduced burning & edge over-plating
Pulse energy limits local overheating and current crowding. -
Lower porosity & improved density
Noticeably fewer pinholes, voids, and inclusions. -
Superior micro-distribution
Improved throwing power, better coverage in edges/corners. -
Lower hydrogen embrittlement
Especially relevant for high-strength steels or spring alloys. -
More controlled thickness build
Enables precision restoration, small-area repair, and decorative finishing. -
Improved plating speed
Shorter process times and higher metal utilization in brush plating.
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Advantages Compared to Conventional DC Brush Plating (Summary)
| Parameter | Continuous DC | HF Pulse Plating |
|---|---|---|
| Grain structure | coarse | fine / nano-crystalline |
| Adhesion | medium | high |
| Porosity | higher | low |
| Hydrogen effects | stronger | reduced |
| Edge burning | common | minimized |
| Layer hardness | standard | higher |
| Accuracy | medium | excellent |
| Thermal load | higher | reduced |
| Speed | medium | higher |
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Application Relevance
HF Pulse Plating is particularly advantageous in:
• restoration & repair plating
• selective / localized deposition
• precious metal finishing (gold, rhodium, platinum, silver)
• chrome-on-chrome touch-up
• aerospace & automotive components
• instrument, medical, watch, and jewelry plating
• high-value refurbishment and micro-restoration
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Why It’s a Good Fit for Tampon/Brush Plating
Brush plating inherently suffers from:
• electrolyte starvation
• small plating zones
• limited agitation
• high local current density
Pulse technology compensates for these constraints and increases layer quality to near bath-plating standards while preserving the selectivity advantages of brush plating.
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