Copper Plate Electrode (SW10051M) Short Description The Copper Plate Electrode is a large‑area sacrificial anode made from high‑purity copper (≥ 99.9 %) designed for electroplating. It provides a consistent supply of copper ions to the electrolyte, promoting stable baths, uniform deposits and improved conductivity in copper plating applications.  Product Description This plate is manufactured from pure copper, which dissolves evenly into the electrolyte to maintain a consistent metal ion concentration. The flat, broad surface makes it ideal for covering larger workpieces or for use in plating tanks where even current distribution is critical to achieving high‑quality copper coatings. Copper anodes like this plate are typically used in bath electroplating settings and can also serve as a foundation layer before other coatings such as nickel or chrome are applied. Typical Applications Electroplating of copper on metal substrates Bath plating for decorative or functional copper layers Undercoat / intermediate layer before nickel or chrome plating Workshop, lab and production electroplating Applications involving larger workpieces requiring extensive coverage  Key Benefits High copper purity (≥ 99.9 %): clean ion release for consistent baths Broad plate design: promotes uniform current distribution Improved deposit quality: even, durable copper coatings Flexible use: suitable for a range of plating setups Easy integration: fits naturally into standard bath electroplating processes  Usage Instructions Preparation: Thoroughly clean and degrease all workpieces prior to plating. Placement: Position the copper plate electrode as the anode (positive terminal) in the electrolyte. Connect: Attach the electrode to the positive output of your power supply and the workpiece to the negative (cathode). Plating: Adjust voltage and current according to the specific copper electrolyte used. Maintenance: Periodically clean off any buildup to maintain performance and longevity. Conclusion The Copper Plate Electrode is a reliable, versatile accessory for copper electroplating, offering consistent performance and uniform deposition thanks to its large active surface and high material purity — suitable for hobbyists, workshop use and professional electroplating environments alike.

PP Copper Electrolyte BMG‑130.1 High-Gloss Copper Plating Solution for Electroplating Applications Short Description The PP Copper Electrolyte BMG‑130.1 is a high-performance electroplating solution for depositing bright, uniform copper layers. It produces thick, glossy coatings suitable for decorative surfaces, functional layers, or as a foundation for further electroplating processes such as nickel or gold. Applications The PP Copper Electrolyte is versatile and can be used for: Electrolytic copper plating of metallic surfaces Protective layers on iron and steel for corrosion resistance Intermediate layer or primer for nickel, gold, or other metals Coating conductive paint on plastics Decorative copper-red finishes Solderable layers for PCBs and electronic boards Its balanced composition makes it suitable for both hobbyist and professional applications in workshops, labs, or industrial environments. How Copper Electroplating Works (Simple Explanation) Electroplating uses direct current (DC) to reduce copper ions from the electrolyte onto the surface: Prepare the workpiece: Clean and degrease. Plating: Connect the workpiece as the cathode; use a graphite or copper anode. Deposition: Copper forms a thick, glossy layer. Post-treatment: Rinse with water and dry – the surface exhibits the characteristic bright copper-red shine. Benefits of PP Copper Electrolyte BMG‑130.1 Bright, uniform, glossy copper layers Thicker deposits than many standard copper solutions Excellent adhesion on conductive substrates Ideal as a base layer for nickel, gold, or other metals Easy to use with graphite or copper anodes Versatile application on plastics with conductive paint Technical Parameters (Guideline Values) PropertyValue / RangeProduct typePP Copper ElectrolyteElectrolyte typeBright copper plating solutionVoltageapprox. 3 V and aboveTemperature14–25 °CCopper content> 60 g/LDeposition rateapprox. 2 µm/min at 3.5 VLayer hardnessapprox. 380–385 HVLayer density8.8 g/cm³Anode materialGraphite or copperApplicationBath, pen, or tampon electroplating Note: Values are practical guidelines; results may vary depending on equipment, voltage, and temperature. Practical Application Instructions Preparation: Clean and degrease surfaces. For non-conductive parts, apply a conductive paint first. Plating: Operate the electrolyte within recommended voltage and temperature ranges. Use graphite or copper anodes for uniform layers. Post-Treatment: Rinse plated parts with water and dry. Light polishing can further enhance gloss if desired. Safety Instructions Wear protective gloves, goggles, and appropriate clothing Avoid contact with skin and eyes Rinse immediately with water if contact occurs Work in well-ventilated areas Do not ingest; keep out of reach of children Dispose according to local chemical waste regulations Conclusion The PP Copper Electrolyte BMG‑130.1 is a high-performance and versatile solution for producing bright, uniform copper layers. Whether for decorative finishes, corrosion protection, or as a foundation for further electroplating, it provides excellent layer quality, easy handling, and professional results for hobbyists, workshops, and industrial applications.