T Gel Thickener BMG‑121.3 Additive for Viscosity Control – Converts Electrolytes into Non-Drip Gels Short Description The Gel Thickener BMG‑121.3 is a specially developed chemical additive that increases the viscosity of electroplating solutions, transforming them into non-drip, gel-like media. This is particularly useful for vertical surfaces or complex-shaped objects, allowing for precise and controlled application without dripping. Applications The Gel Thickener is used to: Increase the viscosity of electroplating solutions Enable drip-free coating on vertical or inclined surfaces Allow precise application on complex or fine structures Reduce material loss caused by dripping Achieve decorative effects in electroplated finishes Ensure uniform coating thickness without runs or streaks How the Gel Thickener Works (Simple Explanation) Some electrolytes are thin and may drip on vertical or inclined surfaces. The Gel Thickener is added in a defined amount to create a gel-like solution that stays in place: Prepare the electroplating solution as usual. Measure and add the Gel Thickener (e.g., 1 part thickener to 10 parts electrolyte; adjust according to desired viscosity). Stir thoroughly until a homogeneous, gel-like consistency is achieved. Apply or plate as usual – the gel adheres to the surface without dripping. Adjusting the ratio allows you to fine-tune the gel consistency from lightly gelled to strongly gel-like. Benefits of Gel Thickener BMG‑121.3 Significantly increased viscosity for precise, drip-free application Controlled, accurate coating on difficult shapes Reduces material waste due to dripping Ensures uniform layer distribution Easy to dose and use Compatible with various electroplating solutions Technical Parameters (Guideline Values) PropertyValue / RangeProduct typeGel thickener / viscosity additiveUseIncreases viscosity of electroplating solutionsMixing ratio*approx. 1:10 (thickener : electrolyte)ConsistencyFrom lightly gelled to strongly gel-likeTemperatureRoom temperatureStorageCool, dry, tightly closedCompatibilityWith standard electroplating solutionsSafetyChemical additive – use protective measures * Optimal ratio depends on the solution, desired gel strength, and application; testing is recommended. Practical Application Instructions Preparation: Prepare the electroplating solution as usual. Dosage: Slowly add the Gel Thickener to the solution in small increments. Adjust according to the desired viscosity. Mixing: Stir thoroughly until a homogeneous gel is obtained. Let rest briefly to remove air bubbles. Application: Apply the gel to vertical or complex surfaces without dripping. After plating, rinse the parts with clean water and dry carefully. Polishing may enhance the finish. Safety Instructions Wear protective gloves, goggles, and appropriate clothing Avoid contact with skin and eyes Rinse immediately with water if contact occurs Use in well-ventilated areas Do not ingest; keep out of reach of children Dispose of according to local chemical regulations Conclusion The Gel Thickener BMG‑121.3 is an effective, easy-to-use additive that converts electroplating solutions into non-drip, gel-like media, enabling precise and controlled coatings on vertical, inclined, or complex surfaces. Its flexibility and ease of use make it an invaluable tool for hobbyists, workshops, and professional electroplaters seeking clean, uniform, and drip-free results.

Anode Fabric Pad Sleeve Fluffy BMG-015 – Uniform Coating & Maximum Control The Anode Fabric Pad Fluffy BMG-015 is a specially designed accessory for pen plating and tampon electroplating, ensuring consistent electrolyte distribution and controlled coating processes. Thanks to its fluffy, high-volume structure, the pad absorbs electrolyte efficiently and releases it evenly and continuously onto the surface. This results in clean, uniform and high-quality metal coatings, even in demanding applications. Key Benefits at a Glance Excellent electrolyte absorption and release Uniform liquid and current distribution Ideal for precise and controlled plating Suitable for: Pen plating Tampon plating Reduces streaking and uneven deposits Flexible and easy to replace Applications Selective metal plating Repair and touch-up work Fine detail applications Jewelry finishing Technical surface treatments Technical Parameters Product Type: Anode fabric pad (fluffy) Item Number: BMG-015 Material: High-absorbency textile fabric Structure: Fluffy / high-volume Function: Electrolyte carrier for anode applications Application Areas: Pen plating Tampon plating Electrolyte Absorption: Very high Electrolyte Release: Even and controlled Current Distribution: Supports uniform deposition Reusability: Limited (depending on application) Replacement: Quick and easy Application – Step by Step 1. Preparation Soak the fabric pad with the appropriate electrolyte Allow excess liquid to drip off slightly Attach to the anode or plating pen 2. Pen Plating Application Move the pad evenly across the surface Maintain consistent contact Control voltage and movement Ensures precise and clean results 3. Tampon Plating Application Use the pad as an electrolyte carrier Apply even pressure Maintain continuous motion  Ideal for selective plating applications Pro Tips for Best Results Replace pad regularly for consistent quality Avoid over-saturation → better control Uniform movement prevents streaks Always use clean electrolyte Conclusion The Anode Fabric Pad Fluffy BMG-015 is an essential accessory for achieving precise, uniform and high-quality results in pen and tampon electroplating. It ensures optimal control, clean finishes and significantly improved coating performance.

Alkaline Copper BMG 093M – Precision, Adhesion & Professional Results The Alkaline Copper from Betzmann Galvanik is a high-performance, versatile electroplating electrolyte designed for demanding applications in bath plating, pen plating, and tampon plating. Engineered for maximum adhesion and uniform deposition, this electrolyte produces smooth, low-stress copper layers, making it ideal as both an intermediate layer and a decorative finish. Suitable for both beginners and professionals, it ensures consistent and reliable results across a wide range of applications. Key Benefits at a Glance Excellent adhesion on various metals Smooth, dense and uniform copper layers Perfect for complex geometries and fine details Suitable for: Bath electroplating Pen plating Tampon plating Beginner-friendly yet professional-grade Reduced internal stress for crack-free coatings Applications Jewelry manufacturing & finishing Repair and restoration Model making & precision engineering PCB and technical applications Decorative metal finishing Technical Parameters Electrolyte type: Alkaline Metal: Copper Application methods: Bath, pen, and tampon plating Working temperature: approx. 20–30 °C pH value: Alkaline (stabilized) Current density: Bath: approx. 0.5 – 2.5 A/dm² Pen/Tampon: adjustable depending on use Voltage: approx. 1–6 V Anode material: Copper (recommended) Application Guide (Beginner to Professional) 1. Surface Preparation (critical for adhesion) Thoroughly degrease the workpiece Activate / pickle depending on base material Rinse with distilled water Avoid touching the surface afterwards 2. Bath Electroplating (efficient & uniform) Fully immerse the workpiece in the electrolyte Apply DC current (follow recommended current density) Plate until desired thickness is achieved Use agitation for uniform results Ideal for larger parts and batch processing 3. Pen Plating (precise & flexible) Apply electrolyte via felt or sponge tip Move the plating pen evenly across the surface Start with low voltage and increase gradually  Perfect for small areas, repairs and detail work  4. Tampon Plating (controlled & mobile) Soak tampon with electrolyte Apply directly to the surface Maintain even pressure and movement  Best for selective plating and hard-to-reach areas  Pro Tips for Best Results Lower current density = finer, smoother layers Higher current density = faster build-up (risk of roughness) Always work with clean solutions and tools Rinse between steps for better quality Maintain stable temperature Conclusion The Alkaline Copper BMG 093M is the perfect choice for anyone seeking reliable, high-quality and versatile copper plating results. Whether you're a beginner or a professional, this electrolyte delivers excellent adhesion, smooth finishes, and consistent performance.

White Palladium Electrolyte 10 g/L BMG‑101M High‑Performance Palladium Plating Solution for Bright, Silver‑White Coatings Short Description The White Palladium Electrolyte 10 g/L BMG‑101M is a premium electroplating solution designed to deposit bright, silver‑white palladium layers. With a palladium concentration of approximately 10 g per liter, this electrolyte produces a brilliant, metallic finish that is even more striking than traditional nickel plating. real-gold.de It can be used both as a hard decorative top layer and as a nickel‑free barrier layer in multi‑step plating systems. real-gold.de Applications White palladium plating is suitable for: Applying bright silver‑white palladium coatings Nickel‑free barrier layers between copper/brass and gold Decorative finishes with high corrosion resistance Prepping surfaces for subsequent gold plating Alternatives to silver plating, as palladium does not tarnish easily  This makes it especially useful for jewelry, electronics, and other applications where an elegant, durable, and nickel‑free surface is desired.  How White Palladium Plating Works (Simple Explanation) Palladium electroplating works by using direct current (DC) to reduce palladium ions from the electrolyte onto the surface of the workpiece: Surface Preparation: Clean and degrease the part thoroughly. Plating: Connect the workpiece as the cathode and apply appropriate voltage. Deposition: Palladium ions reduce and form a uniform, silver‑white metallic coating. Finishing: Rinse with water and dry after plating.  Benefits of White Palladium Electrolyte BMG‑101M Extremely bright, silver‑white metallic finish, brighter than traditional nickel coatings  Nickel‑free and allergen‑free, ideal for skin‑contact applications  Acts as an excellent barrier layer between base metals and gold  High corrosion resistance and very low porosity, improving durability  Suitable on many substrates, including copper, nickel, brass, silver, gold, and dechromed surfaces  Can be solder‑wetted and provides strong performance on electrical contacts Technical Parameters (Practical Data) PropertyValue / RangeElectrolyte typePalladium plating solutionPalladium contentapprox. 10 g/LRecommended voltage3.0–3.5 V (pin electroplating from ~3 V, bath 3–4 V)Operating temperature48–52 °CpH7.0–8.0Deposition rateapprox. 0.17 µm/min at 0.0075 A/cm²Hardnessapprox. 488 HVDensity of depositapprox. 11.85 g/cm³Deposit purity~99.9 % palladiumAnodePlatinum mesh or graphiteAgitationVery low (mini stir rod)Lightness (L*)65 (CIE L* value)Shelf life1–2 yearsHealth/Safety classificationIrritantTransport classificationNot classified as hazardous Note: These values are practical guidelines and may vary depending on equipment, voltage, and material.  Practical Application Instructions Surface Preparation: Clean and degrease parts thoroughly to remove oils and contaminants. Plating: Heat the solution to the recommended temperature (48–52 °C). Apply recommended voltage; stable agitation with a mini stir rod improves coating uniformity. Post‑Treatment: Rinse parts with clean water after plating. Dry carefully; light polishing can enhance the finish if desired. Safety Instructions White palladium electroplating solutions contain active chemical components and must be handled with care: Wear protective gloves, eye protection, and suitable clothing Avoid contact with skin and eyes Rinse thoroughly with water if contact occurs Operate in well‑ventilated areas Do not ingest; keep out of the reach of children Dispose of waste according to local chemical waste regulations  Conclusion The White Palladium Electrolyte 10 g/L BMG‑101M is a professional‑grade electroplating solution that delivers very bright, silver‑white palladium coatings with excellent durability and low porosity. It is particularly suitable for decorative and functional applications, and as a nickel‑free barrier layer before gold plating, making it ideal for jewelry, electronics, and precision metalwork

Metal Polish Ultra-Fine – The Perfect Pre-Treatment for Premium Surface Quality For applications demanding extremely high surface quality and brilliant shine: Metal Polish Ultra-Fine is the top choice for final pre-treatment before electroplating. Ultra-Fine Cleaning Power – Ideal for Sensitive Surfaces This finely tuned formulation gently yet effectively removes: the most delicate silicone and release agent residues ultra-thin wax layers micro-contaminants and particles light oxides and adhesion inhibitors The built-in cleaner delivers deep surface cleanliness – the optimal base for uniform, high-adhesion plating layers. Brilliant, Smooth, Flawless – Even on Sensitive Materials Used with a fine microfiber cloth, this ultra-fine polish will: restore mirror-like shine to chrome and metal bring conductive plastics to a glossy, refined finish refresh used components with an elevated appearance smooth fine details and delicate contours Sensitive parts are treated gently while achieving an exceptionally even finish. Key Benefits at a Glance Ultimate pre-treatment for bath, brush, and swab plating Removes the finest residues and prepares ideal adhesion surfaces Highest level of surface quality and brilliance Suitable for metals, chrome, and conductive plastics Easy and controlled application Designed for workshop, professional labs, and industrial environments Result: Technically pristine, high-gloss surfaces with optimal adhesion and a flawless professional finish.

Silver tarnish protection on aqueous basis from Betzmann Galvanik  Product information  Silver tarnish protection based on nanotechnology  gloss, color and electrical properties are retained  simple dipping process  biologically harmless, skin-friendly and hypoallergenic  for decorative and technical applications  suitable for rack,barrel and strip applications Bath description: The passivation process is based on an aqueous basis, in which the organic inhibitor is present in a finely divided emulsion. The passivation layer is applied by  The passivation layer is applied by immersion, creating a transparent, organic protective film that preserves the appearance and good electrical properties of silver,  e.g. contact resistance and conductivity. The good solderability and bondability of silver is not affected by the passivation layer. Generally, passivation is used to protect silver surfaces from the influence of sulfur compounds during storage. It can also be used to protect copper, palladium and thin gold layers from tarnishing. Due to its chemical composition, the protective film has lubricating properties, which is of great advantage for certain electrical connection elements. The plugging and unplugging forces are significantly reduced by the silver tarnish protection from Betzmann Galvanik. This applies not only to silver surfaces, but also to gold-plated sliding and plug contacts. It is also worth noting that the anti-tarnish layer consists of non-hazardous substances, and that its protective effect allows short-term  thermal stress up to 300°C. Identification of the mixture: Signalwort: Danger HAZARD STATEMENTS H225 Highly flammable liquid and vapor. H304 May be fatal if swallowed and enters airways.  H336 May cause drowsiness and dizziness.  H412 Harmful to aquatic life with long lasting effects. P301+P330+P331 IF INFECTED: Rinse out mouth. DO NOT induce vomiting.  P310 Immediately call POISON CENTER or doctor. P273 Avoid release to the environment. P280 Wear protective gloves/protective clothing/eye protection/face protection. P260 Do not breathe dust/fume/gas/mist/vapor/aerosol. P210 Keep away from heat/sparks/open flames/hot surfaces. Do not smoke. EUH066 Repeated exposure may cause skin dryness or cracking.

Silver Electrode Ø 6 mm (BMG‑009) Short Description The Silver Electrode Ø 6 mm is a high‑purity silver anode (Ag 99.99 %) designed for electroplating applications. It provides a controlled supply of silver ions to the plating bath, enhances deposit quality and reduces silver consumption in bath, pen and pad plating processes.  Product Description Made from electrolytically refined, unalloyed fine silver with a diameter of 6 mm and length of approximately 100 mm, this electrode delivers exceptional electrical conductivity and consistent performance. Its high purity (Ag 99.99) supports stable and efficient plating. When used as a sacrificial anode, the silver dissolves into the plating solution to maintain silver ion concentration, helping to save 40 %–50 % on silver solution costs by reducing the need for frequent top‑up solutions.  Fine silver also has the highest electrical and thermal conductivity of all metals, promoting efficient current flow and stable electrochemical conditions. Typical Applications Silver plating of metal parts via bath, pen or pad methods Lowering contact resistance on conductive surfaces Improving solderability of components Research, electrochemistry and laboratory experiments As an ionization electrode in certain air or water treatment setups  Key Benefits High‑purity fine silver (Ag 99.99 %) for consistent results Excellent conductivity: supports stable current delivery Reduced silver consumption: more cost‑effective plating Universal use: compatible with multiple plating methods Reliable performance for repeated use  Usage Instructions Use with a suitable silver plating electrolyte depending on the method. Connect the silver electrode as the anode to the positive terminal of your power supply. The workpiece acts as the cathode (negative terminal). Adjust voltage and current according to electrolyte recommendations (often low volt range) for even deposits.  Conclusion The Silver Electrode Ø 6 mm is an essential accessory for producing high‑quality silver deposits in electroplating applications. Its high purity, conductivity and cost‑saving potential make it ideal for hobbyists, workshop users and professionals alike