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Gold Electrolyte 4 g/L – Gold Plating Solution Without Free Cyanides

Product information "Gold Electrolyte 4 g/L – Gold Plating Solution Without Free Cyanides"

Gold Electrolyte 4 g/L – for Pen Plating, Tampon Plating and Bath Plating

High-quality gold electrolyte containing 4 g/L gold for professional and private applications in pen plating, tampon plating and bath plating.

This ready-to-use gold electrolyte is suitable for the precise and uniform electroplating of a wide range of electrically conductive surfaces. With a concentration of 4 g of gold per liter, the electrolyte is suitable for both fine decorative coatings and the controlled build-up of thicker gold layers.

The gold is present in the electrolyte as a chemically bound cyanide complex. No free cyanides are contained in the electrolyte.

The electrolyte is highly versatile and can be used for precise pen plating, flexible tampon plating, as well as conventional bath plating.

Your Advantages

  • 4 g/L gold content

  • Ready-to-use gold electrolyte

  • Suitable for pen plating

  • Suitable for tampon plating

  • Suitable for bath plating

  • Bright gold deposition

  • Uniform and controllable coating

  • Suitable for decorative and technical applications

  • Layer thicknesses up to approx. 4 µm

  • Gold deposit containing 99.9% gold

  • Platinum suitable as an electrode

  • Suitable for professional users, workshops and experienced private users

Technical Data

ParameterValue
Gold content4 g/L
pH value4.3–4.5
Operating temperature18–40 °C
Recommended plating factor0.008–0.012 A/cm²
Standard plating factor0.01 A/cm²
Deposition rateapprox. 0.15 µm/min at 0.01 A/cm², 20 °C and low agitation
Maximum layer thickness4 µm
ElectrodePlatinum
Deposit composition99.9% gold
Remaining componentCarbon
Cathode efficiencyapprox. 25%
Hardness190–210 HV
Density19.3 g/cm³
Internal stressMedium
CyanideBound cyanide complex, no free cyanides

For Pen Plating

Pen plating allows individual areas, small sections and smaller workpieces to be selectively gold plated.

Ideal for:

  • Repair plating

  • Re-plating worn areas

  • Individual surfaces

  • Edges and details

  • Jewelry

  • Watches and watch components

  • Electrical contacts

  • Decorative selective plating

The electrolyte is supplied to the surface through a suitable plating pen or plating head.

Pen plating allows highly precise and controlled processing without having to immerse the entire workpiece in a plating bath.

For Tampon Plating

Tampon plating is particularly suitable for larger surfaces, partial areas and difficult-to-access sections.

The electrolyte is supplied to the surface through a suitable electrolyte-soaked tampon. The plating head is moved evenly across the area to be coated, allowing the gold layer to be built up precisely where required.

Typical applications include:

  • Large partial surfaces

  • Repair plating

  • Re-plating

  • Jewelry

  • Decorative components

  • Technical components

  • Difficult-to-access surfaces

Several passes can be used to build up a thicker gold layer in a controlled manner.

For Bath Plating

The gold electrolyte can also be used for conventional bath plating.

The workpiece is immersed completely or partially in the gold electrolyte and connected as the cathode. A suitable platinum electrode is used as the anode.

The process is controlled using the plating factor / current density.

Recommended range:

0.008–0.012 A/cm²

Reference value:

0.01 A/cm²

Example for Current Calculation

For a workpiece surface area of 8 cm² and a plating factor of 0.01 A/cm²:

8 cm² × 0.01 A/cm² = 0.08 A

The required current can therefore be calculated directly from the surface area being plated.

Why No Fixed Voltage Is Specified

With this electrolyte, the plating process is controlled using the plating factor / current density.

The actual voltage required can vary depending on the plating equipment, electrode area, electrode distance, workpiece and electrolyte conditions.

For this reason, no general fixed voltage value is specified as a universal operating parameter for this electrolyte.

Deposition Rate

At a plating factor of 0.01 A/cm², a temperature of 20 °C and low agitation, the specified deposition rate is approximately:

0.15 µm of gold per minute

The actual deposition rate may vary depending on temperature, agitation and the individual operating conditions.

The maximum specified layer thickness is 4 µm.

High-Purity Gold Deposit

The specified deposit composition is:

99.9% gold

with a small remaining carbon content.

The gold deposit has a hardness of approximately 190–210 HV and a density of 19.3 g/cm³.

The quality and appearance of the finished gold coating depend significantly on the preparation and surface quality of the workpiece. Electroplating reproduces the existing surface structure, so scratches, pores and polishing marks should be removed before plating if a high-quality finish is required.

Suitable Applications

The 4 g/L gold electrolyte is suitable for a wide range of applications, including:

  • Jewelry and jewelry components

  • Rings and pendants

  • Watches and watch components

  • Goldsmith work

  • Repair and restoration

  • Re-plating

  • Decorative surfaces

  • Selective gold plating

  • Technical components

  • Electrical contacts

  • High-quality surface finishing

  • Pen plating

  • Tampon plating

  • Bath plating

Suitable Base Materials and Undercoatings

Depending on the base material, suitable surface preparation and intermediate layers may be required for a durable and high-quality gold coating.

Typical base materials include:

  • Silver

  • Copper

  • Brass

  • Bronze

  • Nickel

  • Nickel-containing alloys

  • Other electroplatable metals

For demanding base materials, a suitable barrier, strike or intermediate coating may be required.

Bound Cyanide Complex – No Free Cyanides

The gold is present in the electrolyte as a chemically bound cyanide complex.

No free cyanides are contained in the electrolyte.

This gold chemistry provides a stable electrolyte and controlled gold deposition during the electroplating process.

Available for Private and Professional Users

The gold electrolyte is available for private and commercial users.

Suitable for:

  • Hobby users

  • Goldsmiths

  • Watchmakers

  • Restorers

  • Workshops

  • Side businesses

  • Commercial businesses

  • Professional plating companies

  • Industry

  • Laboratories

High-Quality Gold Electrolyte for Versatile Plating Applications

With 4 g/L gold, this electrolyte provides a versatile solution for electroplating with pen, tampon and bath plating systems.

Whether you need precise repair plating with a plating pen, larger selective areas with tampon plating or conventional bath plating – this electrolyte allows controlled and high-quality gold deposition.

4 g/L gold – 99.9% gold deposit – for pen plating, tampon plating and bath plating.



Gefahr_(1)
Gefahr_(1)

Pictogram    

Signal word            Danger

Hazard statement(s)

H302          Harmful if swallowed.

H313          May be harmful in contact with skin.

H317          May cause an allergic skin reaction.

Precautionary statement(s)

P261          Avoid breathing dust/ fume/ gas/ mist/ vapours/spray. 

P305 + P351 + P338 IF IN EYES: Rinse cautiously with water for several minutes. Remove  contact lenses, if present and easy to do. Continue rinsing.

  HS Code: 3824 99 70

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