Gold Flash
€21.00
Available, delivery time: 1-2 days
Product information "Gold Flash"
High-Performance Gold Electrolyte for Professional Results
The Gold Flash Gold Electrolyte is a premium electroplating solution designed for selective brush plating, swab plating, and bath electroplating processes. It enables fast, uniform, and highly adhesive gold layers on a wide range of metal surfaces.
Perfect for jewelry finishing, repairs, technical applications, and decorative coatings, this electrolyte delivers consistent and reliable results from beginner to professional use.
Technical Parameters & Operating Conditions
General Parameters
- Gold content: approx. 1–5 g/L
- Voltage range: 3 – 12 V
-
Current density:
- Brush/Swab plating: 0.5 – 2 A/dm²
- Bath plating: 0.1 – 1 A/dm²
- Working temperature: 20 – 50 °C (optimal ~30 °C)
- pH value: slightly acidic (product-specific)
-
Layer thickness:
- Flash plating: 0.05 – 0.2 µm
- Build-up plating: up to ~1 µm
Application Instructions (Beginner to Professional)
1. Surface Preparation (Critical Step)
- Thoroughly clean the surface (remove grease, oil, dirt)
- Activate the surface (acid dip / activator)
- Rinse with deionized water
👉 Proper preparation ensures maximum adhesion and durability.
2. Brush Plating (Selective Gold Plating)
Parameters:
- Voltage: 4 – 8 V
- Movement: steady, circular
- continuous electrical contact
Process:
- Apply electrolyte to plating brush
- Connect workpiece as cathode (negative pole)
- Move brush (anode) evenly across surface
- Maintain constant movement
- Stop once desired thickness is reached
👉 Ideal for precision work, repairs, and small areas
3. Swab Plating (Controlled Application)
Parameters:
- Voltage: 5 – 10 V
- Pressure: light to moderate
- Movement: uniform, overlapping
Process:
- Soak swab with electrolyte
- Apply evenly across surface
- Use overlapping strokes
- Repeat for thicker layers
Ideal for medium surfaces and controlled coatings
4. Bath Electroplating (Full Immersion Process)
Parameters:
- Voltage: 2 – 6 V
- Current density: 0.1 – 1 A/dm²
- Time: 30 seconds to several minutes
Process:
- Fill plating bath with electrolyte
- Connect workpiece as cathode
- Position anode correctly
- Immerse workpiece
- Monitor current and time
- Rinse and dry after plating
Ideal for uniform coatings and professional applications
Important Process Guidelines
- Always work on a clean, grease-free surface
- Avoid interruptions during plating
- Maintain stable temperature and voltage
- Prevent contamination of the electrolyte
- Use proper rinsing between steps
Professional Tips
- Pre-plating (nickel or palladium) improves adhesion
- Apply multiple thin layers instead of one thick layer
- Monitor bath composition regularly
- Increase voltage gradually for optimal deposition
Applications
- Jewelry plating and restoration
- Decorative gold coating
- Electrical contacts and precision parts
- Workshop and industrial use
Why This Electrolyte?
This gold electrolyte offers maximum control, excellent adhesion, and brilliant gold finish across all plating methods—making it a reliable choice for both beginners and professionals.
Pictogram
Signal word Danger
Hazard statement(s)
H302 Harmful if swallowed.
H313 May be harmful in contact with skin.
H317 May cause an allergic skin reaction.
Precautionary statement(s)
P261 Avoid breathing dust/ fume/ gas/ mist/ vapours/spray.
P305 + P351 + P338 IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do. Continue rinsing.
HS Code: 3824 99 70