Professional electroplating equipment
€3,100.00
Product information "Professional electroplating equipment "
Professional Electroplating Unit 50 Ampere with Pulse Technology (BMG-PB-50A)
Short Description
The Professional Electroplating Unit 50 Ampere with Pulse Technology is a high-performance, mobile plating system designed to deliver uniform, high-quality metal coatings using advanced high-frequency pulse technology (HFP). It enables fast, reliable electroplating of metals such as gold, silver, nickel, copper, chrome and more — suitable for hobbyists, workshop professionals and advanced users alike.
Product Description
This Power Box system provides up to 50 Amps of plating power combined with a high-frequency pulse process that enhances deposition quality, coating speed and surface integrity. Thanks to its compact, patented design, it’s particularly well-suited for mobile plating tasks including pen/tampon plating and hard-to-reach detail work. The unit automates many settings, simplifying operation for both beginners and experienced operators.
The system is delivered with all essential cables, electrodes, pads and accessories, ready for immediate use without the need for complex configuration.
Typical Applications
This unit can electroplate virtually any conductive metal surface, including:
• 24 ct pure gold and a range of gold colors (white gold, rose gold, antique gold)
• Silver, platinum, palladium
• Nickel, copper (acidic/alkaline)
• Chrome, black chrome, rhodium, black rhodium, black ruthenium
• Zinc, tin, bronze
• Chromed surfaces or chromed plastics with conductive coating
Scope of Delivery
• 1x BMG-PB-50A electroplating unit with high-frequency pulse technology
• 5x extendable spiral cables (4x positive, 1x negative with clamp)
• 4x ergonomic plating handles
• 5x stainless steel electrodes (4× 6 mm, 1× 4 mm stainless steel) 1x Carbon Electrode, 1x Nickelelectrode
• 10x assorted sleeves (thin, thick, multi-layer)
• 4x device cups that fit into built-in holders
• PDF manual and guides, online training videos, personal technical support
• 1-year warranty
High-Frequency Pulse Plating (HFPP) – What It Is
High-Frequency Pulse Plating is a modern electrical deposition method used in brush/tampon plating in which the electrical current is not delivered as a continuous DC output, but rather as rapidly pulsed high-frequency impulses.
Typical pulse ranges:
• frequency: approx. 15–40 kHz
• pulse duration: microseconds to milliseconds
• waveform: usually rectangular/square pulses
• current delivery: modulated duty cycle for controlled metal ion transfer
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How It Works – Core Mechanism
Instead of a constant ion flow (continuous DC), the bath/gel or wet pad receives a sequence of micro-bursts of energy. Between pulses, short relaxation phases allow:
• ion diffusion back to the surface
• local replenishment of metal ions
• reduction of hydrogen buildup
• significantly reduced polarization effects
• lower thermal load on the substrate
The result is faster, cleaner, and denser deposition with lower defect rates.
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Technical Benefits for Brush / Tampon Galvanic Plating
Compared to conventional DC:
-
Higher deposition quality
– smoother grain structure
– higher micro-hardness
– tighter nano-crystalline layer growth
– improved adhesion on difficult substrates -
Reduced burning & edge over-plating
Pulse energy limits local overheating and current crowding. -
Lower porosity & improved density
Noticeably fewer pinholes, voids, and inclusions. -
Superior micro-distribution
Improved throwing power, better coverage in edges/corners. -
Lower hydrogen embrittlement
Especially relevant for high-strength steels or spring alloys. -
More controlled thickness build
Enables precision restoration, small-area repair, and decorative finishing. -
Improved plating speed
Shorter process times and higher metal utilization in brush plating.
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Advantages Compared to Conventional DC Brush Plating (Summary)
| Parameter | Continuous DC | HF Pulse Plating |
|---|---|---|
| Grain structure | coarse | fine / nano-crystalline |
| Adhesion | medium | high |
| Porosity | higher | low |
| Hydrogen effects | stronger | reduced |
| Edge burning | common | minimized |
| Layer hardness | standard | higher |
| Accuracy | medium | excellent |
| Thermal load | higher | reduced |
| Speed | medium | higher |
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Application Relevance
HF Pulse Plating is particularly advantageous in:
• restoration & repair plating
• selective / localized deposition
• precious metal finishing (gold, rhodium, platinum, silver)
• chrome-on-chrome touch-up
• aerospace & automotive components
• instrument, medical, watch, and jewelry plating
• high-value refurbishment and micro-restoration
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Why It’s a Good Fit for Tampon/Brush Plating
Brush plating inherently suffers from:
• electrolyte starvation
• small plating zones
• limited agitation
• high local current density
Pulse technology compensates for these constraints and increases layer quality to near bath-plating standards while preserving the selectivity advantages of brush plating.